Products for PCB’s industry
Final finishing of printed circuits for PCB industry
Tin chemical process UNISTAN
- Is used in horizontal and vertical process
- Recommended for printed circuits « fine line » et « micro fine-line »
The process UNISTAN gives a flat and dense surface which the deposit thickness is between 0.8 and 1.2 microns.
UNISTAN has excellent resistance to oxidation, which enables multiple passages in REFLOW and wave soldering. .
The process UNISTAN can treat circuit boards single and double sided, multilayer, flexible, and rigid-flex.
The process UNISTAN contains a specific system which provides a high deposition.
UNISTAN is used to treat flexible circuits with technology “reel to reel.”
UNISTAN is recommended for circuits “fine line” and “micro-fine line.”
Tin chemical process UNISTAN
UNISTAN
The tin chemical process UNISTAN standard is recommended for circuits “fine line” and “micro-fine line” in production.
UNISTAN S
UNISTAN S is specially formulated for good compatibility of soldermask and increase the deposition rate in production.
UNISTAN T
UNISTAN T is a specific formulation which provides a high deposition rate.