Preparation of copper surfaces for PCB industry

Circuit boards with high definition fine line, with copper tracks often below 100 microns wide, requires very good surface preparation of copper.
The contact must be perfect between the resist and the copper surface of the PCB.
For this reason the mechanical brushing, sanding, scrub, etc … are not sufficiently effective.
This is why NTS has created the formula of ETCHBRITE, product-based sulfuric acid and stabilized hydrogen peroxide, For the preparation of copper surfaces during the manufacture of printed circuits.
The ETCHBRITE 5XXX is an acid formula, degreasing, microetching copper for preparation before coating soldermask, for inner and outer layers before resist and other applications such as HAL.
The ETCHBRITE 5XX dissolved 40 g / l of copper by attacking at a constant speed and uniform.
The ETCHBRITE contains non-foaming surfactants that remove fingerprints and traces of fat. After drying the copper remains passivated which prevents it from oxidizing.

Micro-Etch Adherence promoter 

Micro-Etch NTS 535 has been formulated to solve the adhesion problems of soldermask in the case of surface finishing such as nickel / gold and immersion tin.

Micro-Etch NTS 535 is an acidic solution, stable, ready to use.

Micro-Etch NTS 535 is economical, it dissolves 55 g / l of copper and is easily controlled by analysis according to the treated surface or by colorimetry.