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NTS Chemical process for Industry (En)NTS Chimie pour l'Industrie (fr)
Chemistry for industrial manufacturing of printed circuits

Products for PCB’s industry

Final finishing of printed circuits for PCB industry

NTS products for the manufacture of printed circuits

Tin chemical process UNISTAN

  • Is used in horizontal and vertical process
  • Recommended for printed circuits « fine line » et « micro fine-line »


The process UNISTAN  gives a flat and dense surface which the deposit thickness is between 0.8 and 1.2 microns.

UNISTAN has excellent resistance to oxidation, which enables multiple passages in REFLOW and wave soldering. .

The process  UNISTAN can treat circuit boards single and double sided, multilayer, flexible, and rigid-flex.

The process UNISTAN contains a specific system which provides a high deposition.

UNISTAN is used to treat flexible circuits with technology “reel to reel.”

UNISTAN is recommended for circuits “fine line” and “micro-fine line.”

Tin chemical process UNISTAN


The tin chemical process UNISTAN standard is recommended for circuits “fine line” and “micro-fine line” in production.


UNISTAN S is specially formulated for good compatibility of soldermask and increase the deposition rate in production.


UNISTAN T is a specific formulation which provides a high deposition rate.

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